HMB-E200


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2U Compute Sled for HTCA-E400


Key features

  • Support 3rd Gen Intel® Xeon® Scalable Processor (codenamed Ice lake)
  • Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
  • Support FH3/4L double width or single width PCIe Card
  • Support OCP NIC 3.0 Modules
  • Compatible with HTCA-E400 Series

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Overview

The HMB-E200 compute sled is powered by 3rd Gen Intel® Xeon® Scalable Processor (codenamed Ice lake), and provides front access I/O including storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port, LOM and USB 3.0 ports. The FHHL PCIe x16 slots can support a GPU or FPGA card, in addition to an OCP NIC slot to plug in OCP 3.0 NIC modules. This compute sled is compatible with HTCA-E400 Series network appliances.

Specifications

Model
  HMB-E200A
Processor
  3rd Gen Intel® Xeon® Scalable Processor
(codenamed Ice lake)
Memory
  DDR4 DIMM x8, LRDIMM+ECC
Max capacity Dependent on CPU
Front Panel Interface
  Storage bays x4, PCIe slot x2, OCP NIC
slot x1, mini-DP port (VGA signal), LOM
and USB 3.0 ports
System Compatibility
  HTCA-E400 Series
Temperature
Operating 0~40°C
Storage -40~70°C
Humidity
  5%~90% RH, Non-condensing
Mechanical
Dimension (W x H x D) 216.5 x 85 x 490.2 mm
Weight TBD
Certification
CE Class A
FCC Class A
0

Order Information

HMB-E200A 2U Compute Sled for HTCA-E400

 

All product specifications are subject to change without prior notice