Lanner Joins Telecom Infra Project for Accelerating OpenRAN and MEC Network Platform Development

June 18, 2021, New Taipei City, Taiwan– Lanner Electronics (TAIEX: 6245), a leading provider of SDN/NFV whitebox solutions, today announced its participation in the Telecom Infra Project(TIP). For the past few years, Lanner has actively participated in open networking organizations, such as Open Compute Project (OCP), Metro Ethernet Forum (MEF) and now Telecom Infra Project (TIP), to build open, scalable, hyper-converged white box platforms, empowering service providers to roll out SD-WAN, MEC, Open-RAN and 5G private network deployments.

June 18, 2021, New Taipei City, Taiwan– Lanner Electronics (TAIEX: 6245), a leading provider of SDN/NFV whitebox solutions, today announced its participation in the Telecom Infra Project(TIP). For the past few years, Lanner has actively participated in open networking organizations, such as Open Compute Project (OCP), Metro Ethernet Forum (MEF) and now Telecom Infra Project (TIP), to build open, scalable, hyper-converged white box platforms, empowering service providers to roll out SD-WAN, MEC, Open-RAN and 5G private network deployments.

The Telecom Infra Project (TIP) is a global community of companies and organizations driving infrastructure solutions to advance global connectivity. Founded in 2016, TIP is a community of diverse members representing hundreds of companies, from service providers, technology partners to systems integrators. TIP will explore new approaches and technologies across three initial focus areas: access, core and management, and backhaul.

Lanner aims to participate in TIP’s OpenRAN, Edge Computingand 5G Private Networks Project Groups, which support the development of disaggregated vRAN and MEC solutions based on service provider requirements. Aspiring to bring the ecosystem together, and take on an interoperable approach towards building next-generation 5G networks, TIP Project Groups seeks strong partnerships across the industry with organizations having a similar vision and working to accelerate disaggregation and innovation in SD-WAN and MEC technologies.

“Together with our SDN/NFV ecosystem partners, Lanner will participate in TIP project groups to build vendor-agnostic platforms that accelerate innovation and commercialization in 5G scalable MEC solution,” said Jeans Tseng, CTO of Lanner Electronics. “We believe that our participation in TIP will allow us to collaborate with a community of open networking experts on creating white box platforms that can easily meet specified requirements and integrate into operator networks.”

About Lanner Electronics

Lanner Electronics Inc (TAIEX 6245) is a world-leading provider of design, engineering, and manufacturing services for advanced and customizable SDN/NFV network computing appliances for system integrators, service providers, and applications developers. Lanner possesses a wide range of network appliances, including whitebox vCPE platform for SD-WAN and SD-Security, as well as NEBS-compliant, NFVi-ready HTCA platforms for multi-access computing and Cloud RAN. To learn more about Lanner’s full range of network appliances and whitebox solutions, please visit www.lannerinc.com and http://www.whiteboxsolution.com/

Lanner Joins Telecom Infra Project for Accelerating OpenRAN and MEC Network Platform Development was last modified: June 18th, 2021 by Fernando Contreras