Lanner to Demonstrate Edge Consolidation for Future Manufacturing at Taipei Int’l Industrial Automation Exhibition

To deliver the required real-time, secured and cutting-edge technology as the next-generation manufacturing revolution, Lanner provides highly integrated edge server platform with Intel multi-core processor that fully optimize performance and minimize latencies, while consolidating all the needed network functions.

Come visit our booth at # 1528 at Taipei Int’l Industrial Automation Exhibition, which takes place on Aug 1 to 4 in Taipei Nangang Exhibition Center 1F.

Featured Products

LEC-2580


High-performance IPC with IntelR 6th Gen Skylake Core? i7/i5/i3 CPU

CPU IntelR Core? i7-6600U/i5-6300U/i3- 6100U
Chipset AMI 128Mbit SPI Flash BIOS

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LEC-2137


Optimized IoT-ready Solution for Machine Vision and Physical Security

CPU IntelR Atom? x7-E3950 or IntelR CeleronR N3350
Chipset AMI 64Mbit SPI Flash BIOS

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LEC-7230


Small Form Factor Digital Signage PC with Intel® Bay Trail CPU

CPU 2C or 4C Bay Trail SoC
Chipset AMI SPI Flash BIOS

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Lanner to Demonstrate Edge Consolidation for Future Manufacturing at Taipei Int’l Industrial Automation Exhibition was last modified: August 15th, 2018 by Jorge Peregrina