Open RAN Platforms – Lanner https://www.lanner-america.com Tue, 21 Dec 2021 19:02:13 +0000 en-US hourly 1 https://wordpress.org/?v=6.4.2 https://www.lanner-america.com/wp-content/uploads/cropped-favicon-32x32.png Open RAN Platforms – Lanner https://www.lanner-america.com 32 32 HTCA-E400 https://www.lanner-america.com/product/htca-e400/ Tue, 16 Nov 2021 21:07:29 +0000 https://www.lanner-america.com/?post_type=product&p=116138 Carrier-grade Edge Server Chassis for Open RAN / MEC

Key features

  • Carrier-grade, full redundancy and extreme high performance
  • 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
  • Support 5x 1U compute sleds or 2x 2U+1U compute sleds
  • Support 2x 1U switch sleds for redundancy
  • Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe x16 card
  • 450mm Short Depth Chassis for Edge Deployment
  • Distinguished, Flexible and Front I/O Access
  • 1+1 Redundant Hot-swappable PSU
  • NEBS-3 Compliant for Harsh Conditions
]]> The HTCA-E400, a carrier-grade Open Edge Server, powered by 3rd Gen Intel® Xeon® Scalable Processors (codenamed Ice lake) with built-in AI Acceleration, for 5G Open RAN, Edge Cloud, and AI edge-focused applications with extensive configuration options. HTCA-E400 is a high-performance appliance designed to leverage edge computing for accelerating 5G deployment. HTCA-E400 supports 5x 1U compute...

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]]> HLM-E110 https://www.lanner-america.com/product/hlm-e110/ Tue, 16 Nov 2021 19:46:48 +0000 https://www.lanner-america.com/?post_type=product&p=116130 10/25/100 GbE Switch Sled with Intel® Tofino 2 Series

Key features

  • Fabric interface with 6x 100GbE QSFP28, 8x 10/25GbE SFP+
  • Intel® Tofino 2 Series (BFN-T10-032D-B0) the maximum bandwidth up to 12.8 Tb/s.
  • Compatible with HTCA-E400 Series
]]> The HLM-E110 switch blade provides fabric interface with 100GbE QSFP28 x6, and 10/25GbE SFP+ x8 with Intel® Tofino 2 Series switch controller. This switch blade is compatible with HTCA-E400 Series network appliances to offer 10/25/100GbE fabric connectivity.

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]]> HMB-E100 https://www.lanner-america.com/product/hmb-e100/ Tue, 16 Nov 2021 19:12:14 +0000 https://www.lanner-america.com/?post_type=product&p=116122 1U Compute Sled for HTCA-E400

Key features

  • Support 3rd Gen Intel® Xeon® Scalable Processor (codenamed Ice lake)
  • Front Access I/O: Storage bays x2, PCIe x1, NIC slot x1, mini-DP port, LOM and USB 3.0 ports
  • Support FHHL PCIe x16 cardSupport FHHL PCIe x16 card
  • Support OCP NIC 3.0 Modules
  • Compatible with HTCA-E400 Series
]]> The HMB-E100 compute sled is powered by 3rd Gen Intel® Xeon® Scalable Processor (codenamed Ice lake), and provides front access I/O including storage bays x2, PCIe x1, NIC slot x1, mini-DP port, LOM and USB 3.0 ports. The FHHL PCIe x16 slot can support a GPU or FPGA card, in addition to an OCP NIC slot to plug in OCP 3.0 NIC modules. This compute sled is compatible with HTCA-E400 Series network...

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]]> HMB-E200 https://www.lanner-america.com/product/hmb-e200/ Tue, 16 Nov 2021 18:33:14 +0000 https://www.lanner-america.com/?post_type=product&p=116114 2U Compute Sled for HTCA-E400

Key features

  • Support 3rd Gen Intel® Xeon® Scalable Processor (codenamed Ice lake)
  • Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
  • Support FH3/4L double width or single width PCIe Card
  • Support OCP NIC 3.0 Modules
  • Compatible with HTCA-E400 Series
]]> The HMB-E200 compute sled is powered by 3rd Gen Intel® Xeon® Scalable Processor (codenamed Ice lake), and provides front access I/O including storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port, LOM and USB 3.0 ports. The FHHL PCIe x16 slots can support a GPU or FPGA card, in addition to an OCP NIC slot to plug in OCP 3.0 NIC modules. This compute sled is compatible with HTCA-E400 Series...

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]]> ECA-4025 https://www.lanner-america.com/product/eca-4025/ Wed, 04 Aug 2021 16:54:53 +0000 https://www.lanner-america.com/?post_type=product&p=114731 1U 19" Rackmount Open RAN Appliance with Intel® Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)

Key features

  • Intel® Xeon® D-2100 8/12/14/16 Cores Processor
  • Short Depth Chassis and Wide Operating Temperature -40~65°C
  • 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
  • Front Access I/O with 1x GbE RJ45 for IPMI, 8x 10G SFP+, 1x RJ45 Console, 1x USB 3.0 and Screw-less Fan Replacement
  • 4x 2.5" Internal HDD/SSD Bays, 1x M.2 NVMe 2280 M key
  • 1x PCIe x16 FH/HL slot
  • Intel® QuickAssist Technology
]]> The ECA-4025 features powerful 8, 12,14 or 16-core Intel® Xeon® D-2100 processors, 1x GbE RJ45, and 8x 10G SFP+ of connectivity options, in addition to Intel® QuickAssist Technology for improved network performance. With wide-temperature and short-depth chassis, the ECA-4025 delivers significant performance enhancement in Open RAN, reducing testing and validation efforts, and accelerates time-to...

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