Industrial communications are constantly evolving and enterprises today require optimized solutions and lower maintenance complexity to lead in the competition. To meet the market demand, Lanner further strengthens its industrial-grade box PC product line-up by adding LEC-3034 series. The newly added fanless box PC series features dual-core Intel® Atom E3825, optional 4G LTE mobile connectivity, DDR3L SO-DIMM memory up to 8GB, mSATA socket, VGA display, wide operating temperature, DIN Rail/Wall-mounting options, and a variety of isolated protected serial COM and LAN configurations for various industrial IoT applications.
LEC-3034 series is powered by Intel® Atom E3825 CPU, a dual-core SoC architecture (formerly “Bay Trail”) for optimized performance and power consumption in compact computing systems. With onboard M.2 3042 expansion slot with SIM, LEC-3034 supports 4G-LTE mobile connectivity option, which provides more flexibility and scalability for industrial communications in critical infrastructures. Along with support of DDR3L memory and Intel HD Graphics engine, LEC-3034 series meets the market by functioning as a reliable and robust hardware solution for industrial applications.
Different from traditional DB-9 design, LEC-3034 series comes with Phoenix Contact terminal blocks to offer high density and variety of COM port setting based on the ordered models. LEC-3034 series deliver 4 to 8 Serial ports with RS-232/422/485 signals. With 2KV digital isolation and 15KV ESD protection, the Serial ports are well-protected in harsh environments.
Aside from the multiple serial ports, LEC-3034 also features flexible I/O functionality, including 2 or 4 GbE LAN ports, 2 or 4 USB ports, 1x mSATA mini slot and a VGA display output.
Regarding environmental ruggedness, LEC-3034 can withstand -40 °C to 70 °C operating temperatures. For mounting installation, the system can be mounted by DIN Rail or wall-mounting.
Wireless Rugged Edge Gateway with Intel® Atom E3825 Processor